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Highlight
Semiconductor PV dry vacuum pump
,1200 m³/h dry vacuum pump
,ISO160 KF25 dry vacuum pump
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Pump TypeDry Vacuum Pump
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Pumping Speed1200 M³/h
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Ultimate Pressure≤0.15 Pa
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Motor TypePermanent Magnet Synchronous Motor (PMSM)
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Rated Power1.9+1.9 KW
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Voltage380V Three-Phase
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Cooling Water Temperature5-30 °C
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Cooling Water Flow≥4 L/min
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N2 Purge Flow12-50 L/min
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Inlet ConnectionISO160
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Outlet ConnectionKF25
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Noise Level≤63 DB(A)
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Weight260 Kg
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Dimensions (L×W×H)865×344×751 Mm
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Control InterfaceI/O And RS485 (Modbus Protocol)
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Sealing SystemLip Seal + Labyrinth Seal With N2 Purge
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Gas CompatibilityFlammable, Explosive, And Condensable Process Gases
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Place of OriginChina
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Brand NameGRM
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CertificationISO 9001:2015, ISO 14001:2015, ISO 45001:2018
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Model NumberGRM1201
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Minimum Order Quantity1 Set
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PriceUSD 13,000-20,000 / Set
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Packaging DetailsExport-grade plywood case with vacuum-sealed moisture barrier and shock-proof foam insert
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Delivery Time15-30 working days
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Payment TermsT/T, L/C, Western Union
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Supply Ability300 Sets per Month
GRM1201 1200 M³/H ISO160 KF25 Dry Pump For Semiconductor PV
GRM1201 Dry Vacuum Pump
The GRM1201 is a 1200 m³/h dry vacuum pump with low power consumption and high pumping speed for large exhaust volume applications. It handles flammable, explosive, and condensable process gases, designed for demanding PECVD, MOCVD, and SIC-CVD processes.
Key Features
- Permanent Magnet Synchronous Motor — Delivers superior energy efficiency with industry-leading low power consumption.
- Advanced Rotor Structure — Enhanced dust extraction capability ensures reliable operation in particulate-heavy process environments.
- Dust and Water Vapor Tolerant — Insensitive to dust and water vapor entrained in the pumped gas stream.
- Compact and Integrated Design — Small footprint with high system integration for easy installation in crowded fab environments.
- Comprehensive Protection — Built-in protection functions with strong adaptive capability for varying process conditions.
- Low Vibration and Noise — Operates at ≤63 dB(A) at ultimate pressure for a quieter workplace.
- Advanced Sealing System — Lip seal and labyrinth seal combined with nitrogen purge effectively prevents oil back-streaming, maintaining high vacuum cleanliness in the process chamber.
- Remote Control and Monitoring — Supports I/O interface and RS485 communication (Modbus protocol) for seamless integration into factory automation systems.
- Hazardous Gas Compatible — Safe operation with flammable, explosive, and condensable process gases.
Technical Specifications
| Parameter | Specification |
|---|---|
| Pumping Speed | 1200 m³/h |
| Ultimate Pressure | ≤0.15 Pa |
| Rated Power | 1.9+1.9 kW |
| Voltage | 380V Three-Phase |
| Cooling Water Pressure | 0.2-0.6 MPa |
| Cooling Water Flow | ≥4 L/min |
| Cooling Water Temperature | 5-30 °C |
| Cooling Water Connection | G3/8 |
| N2 Purge Pressure | 0.2-0.6 MPa |
| N2 Purge Flow | 12-50 L/min |
| N2 Purge Connection | G1/4 |
| Inlet Connection | ISO160 |
| Outlet Connection | KF25 |
| Noise Level | ≤63 dB(A) |
| Operating Environment | 5~40°C; ≤80% RH |
| Weight | 260 kg |
| Dimensions (L*W*H) | 865*344*751 mm |
Application Processes
Clean Processes
Load-Lock, Transfer, Metrology, Lithography
Medium Processes
PVD Process, PVD Pre-Clean, RTA, Strip/Ashing, Oxide Etch, Silicon Etch, Implant Source, Metal Etch
Harsh Processes
HDP-CVD, RTP, SACVD, MOCVD, PECVD, LPCVD, ALD
Target Industries
- Semiconductor: Etching, ion implantation, CVD, PECVD, MOCVD, and SIC-CVD clean/medium/harsh process applications.
- Photovoltaic: Crystal growth furnaces, cell manufacturing processes.
- Lithium Battery: Cell vacuum drying, electrolyte filling, and degassing processes.
- Flat Panel Display & LED: Manufacturing processes requiring high-cleanliness vacuum environments.
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