-
Highlight
PMSM dry vacuum pump
,200 m³/h dry vacuum pump
,ISO63 KF25 dry vacuum pump
-
Pump TypeDry Vacuum Pump
-
Pumping Speed200 M³/h
-
Ultimate Pressure≤0.5 Pa
-
Motor TypePermanent Magnet Synchronous Motor (PMSM)
-
Rated Power1.9 KW
-
Voltage380V Three-Phase
-
Cooling Water Temperature5-30 °C
-
Cooling Water Flow≥3 L/min
-
N2 Purge Flow12-50 L/min
-
Inlet ConnectionISO63
-
Outlet ConnectionKF25
-
Noise Level≤63 DB(A)
-
Weight150 Kg
-
Dimensions (L×W×H)741×344×466 Mm
-
Control InterfaceI/O And RS485 (Modbus Protocol)
-
Sealing SystemLip Seal + Labyrinth Seal With N2 Purge
-
Gas CompatibilityFlammable, Explosive, And Condensable Process Gases
-
Place of OriginChina
-
Brand NameGRM
-
CertificationISO 9001:2015, ISO 14001:2015, ISO 45001:2018
-
Model NumberGRM201
-
Minimum Order Quantity1 Set
-
PriceUSD 5,000-8,000 / Set
-
Packaging DetailsExport-grade plywood case with vacuum-sealed moisture barrier and shock-proof foam insert
-
Delivery Time15-30 working days
-
Payment TermsT/T, L/C, Western Union
-
Supply Ability300 Sets per Month
GRM201 PMSM 200 M³/H Dry Running Vacuum Pump ISO63 KF25
GRM201 Dry Vacuum Pump
The GRM201 is a 200 m³/h dry vacuum pump delivering low power consumption and high pumping speed. It safely handles flammable, explosive, and condensable process gases, making it suitable for PECVD, MOCVD, and SIC-CVD semiconductor processes with high reliability and low maintenance costs.
Key Features
- Permanent Magnet Synchronous Motor — Delivers superior energy efficiency with industry-leading low power consumption.
- Advanced Rotor Structure — Enhanced dust extraction capability ensures reliable operation in particulate-heavy process environments.
- Dust and Water Vapor Tolerant — Insensitive to dust and water vapor entrained in the pumped gas stream.
- Compact and Integrated Design — Small footprint with high system integration for easy installation in crowded fab environments.
- Comprehensive Protection — Built-in protection functions with strong adaptive capability for varying process conditions.
- Low Vibration and Noise — Operates at ≤63 dB(A) at ultimate pressure for a quieter workplace.
- Advanced Sealing System — Lip seal and labyrinth seal combined with nitrogen purge effectively prevents oil back-streaming, maintaining high vacuum cleanliness in the process chamber.
- Remote Control and Monitoring — Supports I/O interface and RS485 communication (Modbus protocol) for seamless integration into factory automation systems.
- Hazardous Gas Compatible — Safe operation with flammable, explosive, and condensable process gases.
Technical Specifications
| Parameter | Specification |
|---|---|
| Pumping Speed | 200 m³/h |
| Ultimate Pressure | ≤0.5 Pa |
| Rated Power | 1.9 kW |
| Voltage | 380V Three-Phase |
| Cooling Water Pressure | 0.2-0.6 MPa |
| Cooling Water Flow | ≥3 L/min |
| Cooling Water Temperature | 5-30 °C |
| Cooling Water Connection | G3/8 |
| N2 Purge Pressure | 0.2-0.6 MPa |
| N2 Purge Flow | 12-50 L/min |
| N2 Purge Connection | G1/4 |
| Inlet Connection | ISO63 |
| Outlet Connection | KF25 |
| Noise Level | ≤63 dB(A) |
| Operating Environment | 5~40°C; ≤80% RH |
| Weight | 150 kg |
| Dimensions (L*W*H) | 741*344*466 mm |
Application Processes
Clean Processes
Load-Lock, Transfer, Metrology, Lithography
Medium Processes
PVD Process, PVD Pre-Clean, RTA, Strip/Ashing, Oxide Etch, Silicon Etch, Implant Source, Metal Etch
Harsh Processes
HDP-CVD, RTP, SACVD, MOCVD, PECVD, LPCVD, ALD
Target Industries
- Semiconductor: Etching, ion implantation, CVD, PECVD, MOCVD, and SIC-CVD clean/medium/harsh process applications.
- Photovoltaic: Crystal growth furnaces, cell manufacturing processes.
- Lithium Battery: Cell vacuum drying, electrolyte filling, and degassing processes.
- Flat Panel Display & LED: Manufacturing processes requiring high-cleanliness vacuum environments.
Related Products
Our products are sold all over the world, you can rest assured.
