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380V Three Phase dry vacuum pump
,1800 m³/h dry vacuum pump
,Semiconductor Process dry vacuum pump
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Pump TypeDry Vacuum Pump
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Pumping Speed1800 M³/h
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Ultimate Pressure≤0.5 Pa
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Motor TypePermanent Magnet Synchronous Motor (PMSM)
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Rated Power7.5+4.5 KW
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Voltage380V Three Phase
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Cooling Water Temperature10-30 °C
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Cooling Water Flow6 L/min
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N2 Purge Flow4-96 L/min
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Inlet ConnectionISO160
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Outlet ConnectionKF40
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Noise Level＜70 DB(A)
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Weight472 Kg
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Dimensions (L×W×H)935×420×795 Mm
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Control InterfaceI/O And RS485 (Modbus Protocol)
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Sealing SystemLip Seal + Labyrinth Seal With N2 Purge
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Place of OriginChina
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Brand NameGRH
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CertificationISO 9001:2015, ISO 14001:2015, ISO 45001:2018
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Model NumberGRH1802
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Minimum Order Quantity1 Set
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PriceUSD 12,000-18,000 / Set
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Packaging DetailsExport-grade plywood case with vacuum-sealed moisture barrier and shock-proof foam insert
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Delivery Time15-30 working days
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Payment TermsT/T, L/C, Western Union
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Supply Ability500 Sets per Month
380V Three Phase Dry Vacuum Pump GRH1802 1800 M³/H
GRH1802 Dry Vacuum Pump
The GRH1802 is an 1800 m³/h dry vacuum pump designed for demanding semiconductor and photovoltaic processes. With an oil-free pump chamber, compact footprint, and low energy consumption, it delivers reliable performance with robust dust handling capability.
Key Features
- Permanent Magnet Synchronous Motor — Delivers superior energy efficiency and lower power consumption compared to conventional induction motors.
- Advanced Rotor Structure — Enhanced dust extraction capability, making the pump highly tolerant to particulate-laden process gases.
- Dust and Water Vapor Tolerant — Insensitive to dust and water vapor entrained in the pumped gas stream.
- Compact and Integrated Design — Small footprint with high system integration for easy installation in crowded fab environments.
- Comprehensive Protection — Built-in protection functions with strong adaptive capability for varying process conditions.
- Low Vibration and Noise — Operates at ＜70 dB(A) at ultimate pressure for a quieter workplace.
- Advanced Sealing System — Lip seal and labyrinth seal combined with nitrogen purge effectively prevents oil back-streaming, ensuring high vacuum cleanliness in the process chamber.
- Remote Control and Monitoring — Supports I/O interface and RS485 communication (Modbus protocol) for seamless integration into factory automation systems.
Technical Specifications
| Parameter | Specification |
|---|---|
| Pumping Speed | 1800 m³/h |
| Ultimate Pressure | ≤0.5 Pa |
| Rated Power | 7.5+4.5 kW |
| Voltage | 380V Three-Phase |
| Cooling Water Pressure | 0.3-0.6 MPa |
| Cooling Water Flow | 6 L/min |
| Cooling Water Temperature | 10-30 °C |
| Cooling Water Connection | G3/8 |
| N2 Purge Pressure | 0.3-0.6 MPa |
| N2 Purge Flow | 4-96 L/min |
| N2 Purge Connection | G1/4 |
| Inlet Connection | ISO160 |
| Outlet Connection | KF40 |
| Noise Level | ＜70 dB(A) |
| Operating Environment | 5~40°C; ≤80% RH |
| Weight | 472 kg |
| Dimensions (L*W*H) | 935*420*795 mm |
Application Processes
Clean Processes
Load-Lock, Transfer, Metrology, Lithography
Medium Processes
PVD Process, PVD Pre-Clean, RTA, Strip/Ashing, Oxide Etch, Silicon Etch, Implant Source, Metal Etch
Harsh Processes
HDP-CVD, RTP, SACVD, MOCVD, PECVD, LPCVD, ALD
Target Industries
- Semiconductor: Etching, ion implantation, CVD, and other clean, medium, and harsh process applications.
- Photovoltaic: Crystal growth furnaces, cell manufacturing processes.
- Lithium Battery: Cell vacuum drying, electrolyte filling, and degassing processes.
- Flat Panel Display & LED: Manufacturing processes requiring high-cleanliness vacuum environments.
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